With electronics components decisively shifted to Pb-free, it is becoming difficult to buy components with tin-lead (SnPb) solder balls. The only three responses? Custom order (only if you want >1 million), adapt (seen any Pb-free planes?) or post process (reball). This paper presents the results from a comprehensive study on the ability of reballed BGAs to survive severe environments. Please contact Joelle Arnold, jarnold@dfrsolutions.com, for more information.
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