DfR Solutions Forum

DfR Solutions' Greg Caswell presents at Central Texas Electronics Association in Austin, TX: Feb 21

2012-02-10T08:08:00.006-06:00

Greg Caswell will be making a presentation on "Challenges with Package on Package (PoP)" at this local chapter meeting of IMAPS/SMTA and IPC members. For more information contact Greg Caswell.

Central Texas Electronics Association

Electronics Design & Manufacturing Symposium

Tuesday, February 21, 2012

Freescale Bldg A Conference Center at 7700 W. Parmer Lane

Program:

3:00 - Registration Begins

3:30 - Welcome and Introductions

3:35 - "Comparing Electronic Component Package Materials and Substrate Vendors for

Solder-Joint Reliability Improvements," Joah Rayos, Packaging Engineer, Freescale

4:05 - "Challenges With Package on Package (PoP) Technology"

Greg Caswell, Senior Member of Technical Staff, DfR Solutions

4:35 - Break & Networking

4:45 - "Next Generation Cyber Threats”

John Pirc, Senior Product Line Manager, HP-TippingPoint

5:15 - "Introduction to DSP with the ARM Cortex-M4 Microcontroller"

Sergio Liberman, Senior Microcontroller Systems Engineer, Freescale

5:45 - Closing Remarks

6:00 - Food & Refreshments Served and More Networking

Registration:

RSVP to Bob Baker at: rjbakeratx@austin.rr.com

There is no charge for SMTA and IMAPS members; $10 for all non-members

Event Location:

Freescale Semiconductor Bldg A Conference Center at 7700 West Parmer Lane, Austin, Texas

See Map at: (Map to Freescale)

DfR Solutions at APEC Conference in Orlando, FL: February 8

2012-02-08T06:57:00.004-06:00

Craig Hillman will be making a presentation at the Applied Power Electronics Conference. His presentation will be on "Using Physics and Industry Best Practices to Predict the Lifetime of LED Power Supplies." For more information, contact Craig Hillman.

DfR Solutions' Greg Caswell will be in Connecticut February 7-10

2012-02-07T08:48:00.004-06:00

Greg Caswell will be visiting companies in Connecticut and is available to discuss TSV technology, LEDs, MEMS packaging, and benchmarking your supply chain. If you and your associates are interested in an onsite visit and/or presentation, please contact June Caswell.

DfR Solutions in Orange County/Los Angeles February 8-10

2012-02-02T05:58:00.001-06:00

Walt Tomczykowski will be visiting companies in Southern California and is available to discuss counterfeits, obsolescence, physics of failure, system level reliability and total lifecycle management. If you and your associates are interested in an onsite visit and/or presentation, please contact June Caswell.

DfR's Walt Tomczykowski at GIDEP Meeting in San Diego, CA: February 6-8

2012-02-01T11:12:00.004-06:00

In his role as vice-chair, Walt Tomczykowski will be helping this industry-governmental body understand how to respond to recent counterfeit legislation.

DfR at PERM Meeting in Arlington, VA: February 2

2012-01-31T09:49:00.006-06:00

Craig Hillman and Joelle Arnold will be making a presentation on the status of DfR's two SBIR programs addressing the reliability of reballed BGAs and the reliability of various Pb-free component packages when subjected to shock and vibration testing. For more information contact Joelle Arnold.

Record Attendance at DfR's "Modeling and Simulation in Electronic Packaging" Course

2012-01-30T19:10:00.003-06:00

A packed audience at the 2011 Electronic Packaging and Technologies Conference listened to Craig Hillman provide a comprehensive understanding on how to model and simulate the reliability of the latest semiconductor packaging technologies, including copper wire bonds, through silicon vias (TSV), package on package (PoP), and low glass transition temperature (Tg) underfill. For more information on how DfR is driving modeling and simulation (M&S) to the common engineer, please contact Nathan Blattau.

Walt Tomczykowski Re-Elected Vice Chair of GIDEP Industry Advisory Group

2012-01-29T12:03:00.004-06:00

DfR is proud to announce Walt's continued participation of this important industrial organization. Walt's leadership and insight has become critical as industry and government respond to recent Counterfeit Parts Legislation. As stated by Jim Stein, GIDEP Program Manager, "Walt's breadth and depth of knowledge in the subjects of DMSMS and non-conforming materiel results in his perspectives carrying a lot of weight." For more information on DfR's counterfeit activities, please contact Walt.

DfR and ISD Italia Partner on Sherlock

2012-01-27T08:53:00.004-06:00

DfR is proud to announce that ISD Italia, a leading supplier of software solutions for the electronics industry, will be supporting Sherlock sales and services in Southern Europe and Mediterranean region. For more information, please contact Stefano Barbati.

Application-Specific Integrated Circuits (ASICs) - The Secret to Good Design (Part 2)

2012-01-25T09:58:00.006-06:00

The ASIC design flow is a complex process with many important details. First-pass success is desired, but it requires a few iterations to get the information needed to fully meet specifications. DfR can provide support and guidance to help you navigate this process, which is delineated in this white paper. For more information, contact Francisco Tejada.

DfR Solutions asked to give keynote at DSO National Laboratories Reliability Seminar

2012-01-24T10:14:00.004-06:00

Craig Hillman was recently invited to give the keynote address at the 2011 Reliability Technical Seminar at Singapore's DSO National Laboratories. In his presentation on "Understanding Commercial Best Practices for Ensuring Quality, Reliability, and Durability," Dr. Hillman detailed how leaders in the commercial electronics marketplace have developed effective and methodical processes for ensuring product by laying a foundation of knowledge, early engagement, quality control, and trust-but-verify techniques. For a copy of the presentation, please contact Ed Dodd.

REACH Moves Forward

2012-01-22T18:15:00.007-06:00

The European Chemicals Agency (ECHA) has added twenty (20) more materials to the Candidate List of Substances of Very High Concern (SVHC). While none of the materials tend to be present in electronics, companies must stay abreast of these changes and be aware of their legal obligations. For more information or guidance, please contact Craig Hillman .

Cleanliness - the DfR Way

2012-01-20T05:55:00.005-06:00

Way overdue, IPC-5704 requires the use of ion chromatography (IC) to identify the amount and type of contamination present in printed boards. The document also sets a limit for each contaminant, providing clear pass/fail criterion. It is good to see an industry standard in line with best practices championed by DfR Solutions. DfR performs IC testing routinely for our customers and can help you assure the cleanliness of your electronics. For more information, contact Seth Binfield.

DfR's Survey of the Month: Conformal Coating

2012-01-19T11:29:00.005-06:00

As a service to our valuable readers, DfR has launched our Survey of the Month. Its purpose is to help you gain deeper insight into the latest and greatest within the electronics industry. By participating, you receive a free summary of the survey results. This Survey of the Month focuses on conformal coatings.

DfR Solutions Presenting at RAMS 2012 Conference in Reno, NV: Jan 23-26

2012-01-18T15:19:00.013-06:00

Walt Tomczykowski will be presenting a tutorial "Introduction to Physics of Failure: Delivering Reliable Products" at the RAMS 2012 Conference in Reno, Nevada. In addition, Walt and Ed Dodd will be manning the DfR booth in the exhibit area. Be sure to stop by and visit with them. For more information contact Walt Tomczykowski.

February 7th IPC AHOT Designers Council Meeting

2012-01-12T12:36:00.008-06:00

Upcoming Chapter Meeting on February 7, 2012, 6 P.M.

"Architecting the PCB", Presented by Wayne Pulliam

Successful construction of any complex structure requires planning. The more detailed the planning the better chance the final product will be as expected. Join me in discussing the process of planning a PCB.

Speaker Bio

Wayne Pulliam has been at Advanced Micro Devices for 15 years. In his position as PCB Interconnect Architect, he "floor plans" printed circuit boards for future microprocessor products and advises on current printed circuit board designs. Wayne also controls the pin-outs on all microprocessors and related product to ensure that they are design friendly and cost effective. A PCB designer for 21 years Wayne's background also includes drafting and electrical experience. Several years as an electronics repair technician and several more doing sheet metal case design before entering the field of printed circuit board design. Wayne is a member of the PCB Designer Conference Top Gun Hall of Fame.

Pizza and drinks will be provided: RSVP to Linda at 512-259-2465, or email <mailto:linda@kutzsales.com>
linda@kutzsales.com

Location: Cadence Design Systems, Inc.

12515-7 Research Boulevard, Ste 250

Austin, Texas 78759

512-349-1100

DfR Solutions at 2012 SMTA Houston Expo

2012-01-10T12:22:00.019-06:00

Please join us for our 2012 Houston SMTA Expo & Tech Forum at the Stafford Centre, 10505 Cash Road, Stafford, Texas 77477. Come see what the industry has to offer in new products and services with over 60 tabletop exhibitors. The Expo will be held in Ballroom A through C and the Tech Forum will be held in Room 104 and 105. Free lunch catered by the Black Eyed Pea.

We are pleased to offer an outstanding technical program this year:

11 AM Flex Circuit Design for Reliability

Speaker: Steve Kelly, PFC Flexible Circuits Limited

Abstract: The design of flexible circuits presents a challenge to those who are primarily familiar with rigid boards. This presentation discusses the construction of six basic types of flex and rigid flex circuits and the properties of the materials that they are made from. Flex circuits have special layout rules due to the fact that they will be bent in the application, and because the material properties create unique challenges in assembly. The major differences between flex and rigid board layouts will be discussed, as well as a short primer on design for impedance control in flex circuits.

Speaker: Steve Kelly is the President and founder of PFC Flexible Circuits Limited in Toronto, Ontario. He has been involved in the design and manufacture of flex and rigid flex circuits for 28 years. Steve holds a Bachelor’s degree from McMaster University and an MBA from the University of Western Ontario.

Abstract: A long-time need for high temperature solders has existed in many industries including industrial controls, aerospace, and oil exploration. Basic material requirements have typically been ease of assembly, resistance to creep, low cost, and more recently Pb-free. Now may be the perfect time to rethink some of these past approaches. This presentation will review traditional approaches and some variations, then expand into some of the many alternative methodologies that are in recent use as well as those under development or being evaluated.

Speaker: Cheryl Tulkoff is an industry renowned expert in the fields of semiconductor fabrication, electronics assembly, RoHS conversion, and reliability engineering and management. At her most recent position at National Instruments, Cheryl developed a comprehensive reliability organization, including the creation of an internal failure analysis group and a closed loop reliability program. She has also taken the lead in process development and implementation in semiconductor fabrication through her work at Cypress Semiconductor in electronics assembly, and through her work at IBM. Cheryl is the head of DfR’s newest office located in Austin, Texas, which opened in February 2009.

Abstract: Over the past few years, the test philosophy has changed from ICT (in-circuit testing) to flying probe testing due to the cost of fixturing and required engineering resources. This presentation will review the history of automated test systems, how far technology has advanced the capabilities of flying probe testing and how to develop a test strategy to ensure best overall test coverage and throughput.

Speaker: John Oaf is Applications Manager for the Takaya Group at Texmac, Inc. He has over 24 years experience in production testing at GenRad, Inc. and Teradyne, Inc.

FREE LUNCH and LOTS OF DOOR PRIZES

2012 Show Schedule

10 a.m. Expo open to attendees

11:00 a.m.-11:45 a.m. Technical Presentation

Topic: Flex Circuit Design for Reliability

Speaker: Steve Kelly, PFC Flexible Circuits

11:45 a.m. Door prize drawing

12:15 p.m. - 12:45 p.m. – Free Lunch

12:45 p.m. - 1:00 p.m. - Random Drawings for Gift Certificates and Special Mid-Day Prize

(must be present to win)

1:00 p.m. - 1:45 p.m. Technical Presentation

Topic : Advances & Challenges in High Temperature Component Attachment

Speaker: Cheryl Tulkoff, DfR Solutions, LLC

1:45 p.m. Door prize drawing

2:00pm-2:45pm Technical Presentation

Topic: How Flying Probers Optimize Test Strategy

Speaker: John Oaf, TEXMAC Inc.

2:45 p.m. Door prize drawing

3:00 p.m. - 3:15 p.m. - Random Drawings for Gift Certificates and Special Afternoon Prize (must be present to win) 3:15 p.m. - 3:30 p.m. - Drawings for Bingo Prize (need not be present to win)

Drawing for Free Booth for 2013 (exhibitors only) 3:00 p.m. - 5:00 p.m. - Networking Reception - Beverages and Snacks - no charge

We look forward to seeing you at the Expo on February 9! Please register on-line or call the SMTA at (952)920-7682. For exhibitors, we have extended the early-bird rate until January 31.

Free Texas ESDA Event: Future Trends Presentation "Clouds in the Forecast?

2012-01-09T08:46:00.006-06:00

"Future Trends Presentation "Clouds in the Forecast?"

3M Innovation Center

Austin, TX

Tuesday, Jan 24, 2012 (3-5 PM)

Our next Texas ESD Association meeting is on future trends in electronics. A wide variety of factors drives electronic equipment sales, which drives semiconductor designs (and a little vice versa). So it's important to understand what products are hot, what features are attractive, where influences are coming from, and what seems like will never make it. On the heels of the Consumer Electronics Show and the turn of a new year, this will be an interactive presentation, discussing trends that are emerging in technologies, markets that show promise and companies that are riding the waves.

Tom Starnes analyzes the products, technologies, companies, applications, markets, and business strategies of the embedded processor industry. Before joining market research firm Objective Analysis and consulting at Strategy Sanity, he built a reputation for keen insight while an analyst at Gartner Dataquest. His technical and business credentials come from marketing processors at Motorola (now Freescale) after earning a BSEE from the University of Texas.

RSVP - no charge for attending however for this meeting we do require you to reply to this email and RSVP with your name, company, phone and email for planning purposes. Your information is not given outside the Texas ESD Association except 3M security for badging purposes.

RSVP to: rayb1721@yahoo.com

DfR Chairing Pad Cratering Session at IPC APEX Expo on Thu, Mar 1, 2012

2012-01-06T05:53:00.003-06:00

Thu, Mar 1, 2012 - 10:15 AM to 11:45 AM

Pad Cratering

Presenter/Committee Chair(s):
Jim Griffin, OEM Marketing Mgr, Integral Technology
Cheryl Tulkoff, Senior Member tech staff, DfR Solutions
John McMahon, Engineering Operations Consultant, Celestica
Anurag Bansal, Cisco Systems Inc.

Topic/Track: Assembly Processes for Lead Free and Tin Lead

Event Type: Technical Conference Session

In the switch to lead free, one of the unpleasant side effects of the use of higher temperatures in assembly has been pad cratering. This session brings in experts from assembly who will discuss tests to predict and diagnose pad cratering. If you have had a lead-free process "crater," then the information in this session is what you need!

The Application of Spherical Bend Testing to Predict Safe Working Manufacturing Process Strains, John McMahon
Investigation of Pad Cratering in Large Flip-Chip BGA Using Acoustic Emission, Anurag Bansal
Pad Cratering, Jim Griffin

If you are registered for the All-Access Package or for the Full Conference, attend any conference session. If you are registered for the One-Day Conference, please note that you will only be allowed into the conference sessions occurring on the day of your badge. To register for all conference sessions, return to your registration and select the All-Access Package or the Full Conference.

DfR's Cheryl Tulkoff to present IPC APEX Professional Development Course on DFM

2012-01-05T10:19:00.006-06:00

Sun, Feb 26, 2012 - 9:00 AM to 12:00 PM

PD08: Design for Manufacturing

Presenter/Committee Chair(s):
Cheryl Tulkoff, Senior Member tech staff, DfR Solutions

Topic/Track: Design

Event Type: Professional Development

Level: Intermediate

Gain first-hand information on issues that impact both leaded and lead-free manufacturability and performance requirements; the course will offer practical recommendations for meeting the challenges of managing the interconnection of both through-hole and surface mount technology at the bare board level. Increasingly sophisticated PCB fabrication technologies and processes will be discussed, including: laminate selection, trace width and spacing, solder mask and finishes. Design for manufacturability (DFM) best practices ensure that manufacturing capability is taken into consideration during the design and layout of a product. Understanding the effects of - and how to avoid - overtaxing their manufacturer, engineers can be more confident about design execution. Participants will gain a greater understanding of potential manufacturability hazards to avoid during the design process.

What You Will Learn

Printed boards and process material selection
Plated-through hole design
Conductor width and spacing
Keep-out zones
Copper balancing
Microvias, via fill technologies
Multiple lamination
Equipment process controls and reliability testing
Matching PCB complexity to supplier capabilities
Partnering and off-shore strategies
Importance of supplier report cards to monitor quality and reliability
Cover circuit card assemble
Pad geometries, component spacing and location
Heat sink selection
Standoffs and wiring
Influences of PCB thickness, cut-outs, and depanelization techniques on reliability
Comparison of surface mount, wave and hand soldering
Moisture Sensitivity Level handling, process optimization and control strategies, repair and rework.

DfR's Google Calendar

2012-01-04T08:40:00.004-06:00

Look for DfR at upcoming events, conferences, webinars, and sales visits that may be in your area on our new link to Google Calendar. For more information on a specific activity, please contact June Caswell, jcaswell@dfrsolutions.com.

How Do Engineers Really Think?

2012-01-03T08:43:00.003-06:00

As part of DfR's ISO 9000 activity, procedures for all operations were generated. When it came to an overall engineering process, we truly followed the mantra of "Say What You Do and Do what You Say ." We were amazed at how closely ISO and the product reliability story in this newsletter coincided. To learn more about our engineering flow contact Nathan Blattau, nblattau@dfrsolutions.com.

Product Reliability - Duct Tape to the Rescue

2012-01-02T09:32:00.004-06:00

We have often seen how duct tape can be used to patch, mend, bind, connect, or assemble almost anything.This article shows how absolutely reliable duct tape really is. DfR's expertise with duct tape is world renowned. For more information, contact our duct tape expert – Craig Hillman, chillman@dfrsolutions.com.

Minnetronix Using DfR's Sherlock ADA Software

2011-12-30T07:55:00.003-06:00

Minnetronix, a medical electronics and lifesciences design, development and manufacturing company has selected DfR's Sherlock ADA software to enhance the reliability of their Class III cardiovascular and monitoring systems. Rarely can medical electronics manufacturers afford to build the number of modules required for full reliability testing and Sherlock provides a means to analyze the thermal and mechanical stresses on an assembly and improve the design without repeated reliability testing. For more information on Sherlock, please contact Ed Dodd, edodd@dfrsolutions.com.

DfR Awarded Navy SBIR for Shock and Vibration

2011-12-28T07:44:00.004-06:00

DfR is proud to announce it has been awarded a Phase II SBIR grant by the US Navy to assess the impact of Shock and Vibration on advanced packaging technologies (BGAs, flip chip BGAs, CSPs, etc) coupled with Pb-free solders. AS Pb-free electronics are known to have issues with Shock and Vibration, DfR has been selected to examine this concern. This is the largest study ever funded in this critical area for high rel applications. For more information, please contact Joelle Arnold, jarnold@dfrsolutions.com.

Integrated Circuit (IC) Wearout

2011-12-27T05:58:00.005-06:00

As transistors continue to shrink, the integrated circuit industry has highlighted some of the challenges in manufacturing this technology. More recently, DfR has highlighted some of the challenges in making this technology reliable. See who else agrees reliability of new IC's is an issue. For more information, contact Ed Wyrwas, ewyrwas@dfrsolutions.com.

China RoHS Update

2011-12-26T09:38:00.004-06:00

China is just the next entity to update their environmental legislation. This article provides you and your company insight into what is necessary to interact with China with respect to RoHS. DfR can work with you to help resolve RoHS and Pb-free manufacturing questions. For more information, contact Craig Hillman, chillman@dfrsolutions.com

Message from the DfR Solutions CEO

2011-12-25T17:22:00.002-06:00

As 2011 draws to a close, I want to thank all of our colleagues and customers for a very fruitful and dynamic year. DfR continues to grow rapidly and we believe our consistent success comes from a high number of returning customers, who recognize the quality and value of our services, and our continued expansion into new and exciting opportunities, including releasing our unrivaled Automated Design Analysis software and becoming a thought leader for the Department of Defense. We have been especially pleased at the recognition we are receiving in high growth markets such as solar power, LED lighting, and electric vehicles. Products can't be green unless they're safe and reliable!

Please enjoy this holiday season with your friends and family. Wish for a lot of snow (especially if you have three children under nine) and please be safe and healthy.

Obsolescence? What Obsolescence?

2011-12-23T09:33:00.004-06:00

One of the more common challenges DfR helps resolve is dealing with obsolete parts (which, of course, drives counterfeits). However, this insightful graph from EDN turns common sense on its head. Three out of the top four integrated circuit (IC) technologies are 130nm, 180nm, and 500nm and volumes are expected to be relatively steady for most IC technologies. Can we finally expect our parts to be around for more than 3 years? For more information on obsolescence mitigation, please contact Walt Tomczykowski wtomczykowski@dfrsolutions.com.

Conformal Coating - Why, What, When and How

2011-12-21T17:50:00.003-06:00

Conformal coating can be crucial in outdoor environments, but a number of our customers still struggle with when to coat, where to apply, how much, what material, and how to qualify. This white paper clearly provides a checklist to help identify the need and the right materials, processes, and equipment. For assistance with conformal coating, contact Greg Caswell, gcaswell@dfrsolutions.com.

Power Supply Design: Part 2

2011-12-09T08:22:00.003-06:00

As part of an ongoing series, Dr. Ron Wunderlich continues to provide insight on successful power supply design. In this white paper, he covers the appropriate selection and use of magnetics in power supply design. For more information designing, reviewing, or qualifying power supplies, please contact Ron Wunderlich, rwunderlich@dfrsolutions.com.

DfR's Tool of the Month: Calculating Sample Size

2011-12-08T11:14:00.005-06:00

One of the most common questions asked by customers is how to determine sample size for life testing. One of the most straightforward is Weibayes Theorem. To make your life easier, we have incorporated it into a spreadsheet . For more information on DfR's statistical analysis capabilities, contact Joelle Arnold, jarnold@dfrsolutions.com.

DfR is Having an Open House!

2011-12-07T03:08:00.006-06:00

DfR Solutions would like to invite you to our Holiday Open House on Wednesday, December 14, 2011, from 9am to 3pm. Meet our technical staff, learn from our technical presentations, explore our state of the art facility, and see a live demonstration of our award- winning new software tool, Sherlock Automated Design Analysis™. We'll even feed you!

Registrations must be received by December 9. And, you could win an iPad 2! Register by November 30, 2011, and you'll be entered to win. Click here for more details about the DfR Solutions Holiday Open House. We look forward to seeing you there! Contact Tammy, tsmittenaar@dfrsolutions.com to register!

Microelectronics Reliability and Qualification Workshop in El Segundo, CA: December 13

2011-12-06T09:37:00.005-06:00

Ed Wyrwas will be making a presentation entitled "Silicon to Systems: Integrating Physics of Failure Assessments Into All Levels of Electronics Packaging" at this workshop. For more information, contact Ed Wyrwas, ewyrwas@dfrsolutions.com.

DfR at Microelectronics Reliability and Qualification Workshop in El Segundo, CA: December 13

2011-11-30T08:21:00.008-06:00

Craig Hillman and Ed Wyrwas will be presenting DfR's Silicon-to-Systems solution for predicting reliability at the Microelectronics Reliability and Qualification Workshop on December 13th. For registration information, please contact Ronald Lacoe, ronald.c.lacoe@aero.org.

DfR Solutions Has An Opening for CAM / CAE Engineer

2011-11-28T14:23:00.003-06:00

CAM / CAE Engineer

A rapidly growing high technology software and consulting company is looking for mechanical engineer with experience with Abaqus finite element method (FEM) software.

The position has two primary responsibilities. The first responsibility is performing FEM simulations for Fortune 500 companies. The focus of the FEM simulations will primarily be on electronics and microelectronics packaging. Examples include vibration of circuit cards, temperature cycling of chip scale packages, and bending of fiber optic channels. These consultations may also periodically involve testing to validate FEM predictions.

The second responsibility is to provide support to customers of Sherlock Automated Design Analysis™ software. The tool performs physics-based reliability predictions and design rule checks for the electronics industry. Some of the analysis involves an embedded FEM engine. A successful applicant will be thoroughly trained on the architecture and capabilities with the software and will be expected to train customers, answer questions, and perform analyses using the software. A minor amount of travel (once or twice a quarter) may eventually be required as part of this position.

The ideal candidate will thoroughly enjoy problem-solving and have the ability to communicate findings, both verbally and in writing, to customers. A Masters’ Degree in Mechanical Engineering is highly preferred, but work experience may be an acceptable substitute. Applicants must also be comfortable working as part of a team with people from a variety of technical backgrounds. An availability to start immediately is preferred.

About DfR

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry. The company’s integrated use of Physics of Failure (PoF) and Best Practices provides crucial insights and solutions early in product design and development and throughout the product life cycle. DfR Solutions specializes in providing knowledge- and science-based solutions to maximize and accelerate the product integrity assurance activities of their clients in every marketplace for electronic technologies (consumer, industrial, automotive, medical, military, telecom, oil drilling, and throughout the electronic component and material supply chain). For more information regarding DfR Solutions, visit www.dfrsolutions.com.

Manufacturability and Reliability of 0.3mm Pitch Chip Scale Packages

2011-11-23T14:29:00.002-06:00

SAVE THE DATE: Tuesday, December 6, 2011, 11am EDT

As parts get smaller and smaller and the pitch between contacts gets closer and closer, assuring reliability during manufacturing becomes more and more difficult.

To successfully move to 0.3mm pitch requires buy-in from the entire manufacturing industry, from the printed board manufacturer, to the solder paste supplier, to the stencil manufacturer, and a comprehensive understanding of the potential reliability risks that the change in interconnect design may entail.

Attend this informative webinar presented jointly by ITM Consulting and DfR Solutions, a leading provider of quality, reliability, and durability research and services for the electronics industry, and learn about this issue from the perspective of the manufacturing and reliability.

Don't miss out! Early Bird Registration here .

To learn more about DfR Solutions, click here.

Electronics Packaging Technology Conference in Singapore: December 7

2011-11-21T07:00:00.003-06:00

DfR Solutions will be teaching a NEW full-day course titled "Reliability Predictions for Packaging and Tools for Analyzing Risks and Grading Packages at Board Level" at the Electronics Packaging Technology Conference. The course will be in two parts with the first addressing semiconductor packaging and the second board level reliability. For more information please contact Craig Hillman, chillman@dfrsolutions.com.

Read All About DfR Solutions!

2011-11-17T09:09:00.009-06:00

ECN Magazine published Nathan Blattau's article, "Achieving Product Reliability with Automated Design Analysis Software" in their September edition, and Touch Panel Newsletter recently published Craig Hillman's article "Capturing the Robustness of Glass Panels in Touch Screen Displays." Be sure to check out both articles. For more information contact Nathan Blattau, nblattau@dfrsolutions.com.

DfR in Israel: December 4-8

2011-11-16T09:08:00.001-06:00

Cheryl Tulkoff will be presenting a two day course for ILTAM addressing topics such as Advanced packaging Technologies, Supplier Qualification, Developing a Test Plan, Pb-free, and Design for Manufacturability. She will also be visiting customers in Israel. If you would like to arrange a visit, please contact June Caswell, jcaswell@dfrsolutions.com.

New Technologies in Electronic Packaging: Munich, Germany: November 17

2011-11-15T06:10:00.002-06:00

Craig Hillman will be presenting a half day course addressing topics such as Copper Wire Bonds, Through Silicon Via (TSV), Copper Pillar, Stacked Die, and Bottom Terminated Components (BTC). He will also be visiting customers in Germany. If you would like to arrange a visit, please contact June Caswell, jcaswell@dfrsolutions.com.

Shock Webtorial in Conjunction with Qualmark: Thursday, November 17)

2011-11-14T05:58:00.005-06:00

Dr. Nathan Blattau, DfR's Chief Technologist, will be the featured presenter for a special 2-part edition of Qualmark's popular Ask the Experts webinar series this fall. Mark your calendars to attend the October 20th session on Vibration and the November 17th session on Shock when Dr. Blattau will discuss the effects of these stresses and how they can be effectively applied during product development and process verification to deliver a more reliable product. Registration is now open .

DfR's Craig Hillman in Germany November 14-18

2011-11-11T05:59:00.003-06:00

Craig Hillman will be visiting customers in various parts of Germany, including Munich, Frankfurt, and Berlin. If you would like to schedule a visit to your company while he is in your area, please contact June Caswell, jcaswell@dfrsolutions.com.

TechSearch International –Fraunhofer Institute-Advanced Packaging Trends for Medical Electronics Workshop: Munich, Germany: November 14

2011-11-10T06:10:00.004-06:00

Craig Hillman will be making a presentation entitled "Dealing with New RoHS Regulations in Medical Devices: An Update" at this workshop preceding Productronica. If you would like to meet with Craig while he is in the area please contact June Caswell, jcaswell@dfrsolutions.com.